POLASTECH Inc. presented at Asian HPC Infrastructure 2026, held on January 23, 2026, at the RIKEN Center for Computational Science (R-CCS).
In this presentation, we introduced the fundamentals of adsorption-based cooling technology and discussed its potential role in next-generation data center infrastructure.
The session highlighted a transition from conventional compression chillers to material-driven cooling, enabling efficient utilization of low-temperature waste heat and significantly reducing electricity consumption.
POLASTECH’s adsorption heat pump technology offers a sustainable cooling solution for high-performance computing (HPC) and AI data centers, contributing to improved energy efficiency and decarbonization.
We would like to thank the organizers and participants of Asian HPC Infrastructure 2026 for the opportunity to share our work.
